GROUND MEMBER, SHIELD PRINTED WIRING BOARD, AND METHOD OF MANUFACTURING SHIELD PRINTED WIRING BOARD

To provide a ground member, placeable at any position, less likely to cause misalignment between conductive projections of the ground member and a shield layer of a shield film when mounting components on a shielded printed circuit board with the ground member by repeatedly heating and cooling compo...

Full description

Saved in:
Bibliographic Details
Main Authors TAJIMA HIROSHI, HARUNA YUSUKE, HASEGAWA TAKESHI, KATSUKI TAKAHIKO
Format Patent
LanguageEnglish
Japanese
Published 18.06.2020
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:To provide a ground member, placeable at any position, less likely to cause misalignment between conductive projections of the ground member and a shield layer of a shield film when mounting components on a shielded printed circuit board with the ground member by repeatedly heating and cooling components.SOLUTION: The ground member has a first main surface and a second main surface on an opposite side of the first main surface. The ground member consists of an external connecting member having electrical conductivity. The first main surface has conductive projections. A low-melting-point metal layer is formed on a surface of the conductive projections.SELECTED DRAWING: Figure 1 【課題】 本発明は、任意の位置に配置できるグランド部材であって、該グランド部材を用いたシールドプリント配線板に、加熱及び冷却を繰り返して部品を実装する際に、グランド部材の導電性突起とシールドフィルムのシールド層との間にずれが生じにくいグランド部材を提供することを目的とする。【解決手段】 本発明のグランド部材は、第1主面と、上記第1主面の反対側の第2主面とを有し、かつ、導電性を有する外部接続部材からなり、上記第1主面には導電性突起があるグランド部材であって、上記導電性突起の表面には、低融点金属層が形成されていることを特徴とする。【選択図】図1
Bibliography:Application Number: JP20200020496