POLYAMIC ACID SOLUTION AND PRODUCTION METHOD OF LAMINATE USING THE SAME

To provide a PAA solution which can sufficiently retain adhesion of a polyimide (PI) film to a glass substrate even when a thickness of the PI film is made thick, and to provide a production method of a laminate consisting of the PI film and the glass substrate using the same.SOLUTION: A PAA solutio...

Full description

Saved in:
Bibliographic Details
Main Authors ECHIGO YOSHIAKI, SUGIMOTO YOSUKE, YOSHIDA TAKESHI, SHIGETA AKIRA, YAMADA HIROKI
Format Patent
LanguageEnglish
Japanese
Published 18.06.2020
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:To provide a PAA solution which can sufficiently retain adhesion of a polyimide (PI) film to a glass substrate even when a thickness of the PI film is made thick, and to provide a production method of a laminate consisting of the PI film and the glass substrate using the same.SOLUTION: A PAA solution is a solution composed of polyamic acid (PAA), a solvent and alkoxysilane. The PAA is obtained by making an aromatic diamine and an aromatic tetracarboxylic dianhydride react with each other in a solvent. A molar ratio obtained by dividing the total amount by mole of the aromatic tetracarboxylic dianhydride by that of the aromatic diamine is 1.000 or more and 1.050 or less. A production method of a laminate composed of a PI film and a glass substrate is a forming method of the PI film on the glass substrate by applying the PAA solution to the glass substrate, drying, and thermal curing, in which thermal curing is conducted by continuously rising temperature.SELECTED DRAWING: None 【課題】ポリイミド(PI)フィルムの厚みを厚くした場合であっても、ガラス基板への密着性を十分に確保することができる、PAA溶液およびこれを用いた、PIフィルムとガラス基板とからなる積層体の製造方法の提供。【解決手段】ポリアミック酸(PAA)と溶媒とアルコキシシランとからなる溶液であり、前記PAAは、芳香族ジアミンと芳香族テトラカルボン酸二無水物とを溶媒中で反応させることにより得られ、前記芳香族テトラカルボン酸二無水物の全モル数を、前記芳香族ジアミンの全モル数で除したモル比が、1.000以上、1.050以下であることを特徴とするPAA溶液。前記PAA溶液をガラス基板に塗布、乾燥、熱硬化することにより、PIフィルムをガラス基板上に形成させる方法において、熱硬化を連続的に昇温することにより行うことを特徴とするPIフィルムとガラス基板とからなる積層体の製造方法。【選択図】なし
Bibliography:Application Number: JP20190218051