LAMINATE
To provide a laminate excellent in adhesiveness with a polyamide resin substrate without using an adhesive.SOLUTION: There is provided a laminate having at least two layers of a resin layer (A) and a substrate layer (B), wherein the resin layer (A) is formed by directly adhering onto the substrate l...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
18.06.2020
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a laminate excellent in adhesiveness with a polyamide resin substrate without using an adhesive.SOLUTION: There is provided a laminate having at least two layers of a resin layer (A) and a substrate layer (B), wherein the resin layer (A) is formed by directly adhering onto the substrate layer (B), the resin layer (A) contains an ethylene-propylene copolymer (C) having a specific constitutional unit, an MFR, a density and a total amount of vinyl and vinylidene in an ethylene-propylene copolymer and the substrate layer (B) is a film in which at least a surface in contact with the resin layer (A) is essentially composed of a polyamide resin as a main component.SELECTED DRAWING: None
【課題】接着剤を使用せずにポリアミド樹脂基材との良好な接着性に優れた積層体を提供する。【解決手段】樹脂層(A)および基材層(B)の少なくとも2層を有し、樹脂層(A)は、前記基材層(B)上に直接接着することにより形成され、樹脂層(A)が、特定の構成単位、MFR、密度及びエチレン・プロピレン共重合体中のビニル、ビニリデンの合計量を有するエチレン・プロピレン共重合体(C)を含有し、基材層(B)が、少なくとも樹脂層(A)と接する面がポリアミド樹脂を主成分として必須とするフィルムであることを特徴とする積層体である。【選択図】なし |
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Bibliography: | Application Number: JP20180230618 |