SHIELD FILM, SHIELD PRINTED WIRING BOARD, AND MANUFACTURING METHOD OF SHIELD PRINTED WIRING BOARD

• Main Authors: TAJIMA HIROSHI, HARUNA YUSUKE, HASEGAWA TAKESHI, KATSUKI TAKAHIKO
• Format: Patent
• Language: English; Japanese
• Published: 11.06.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; PRINTED CIRCUITS; USE OF MATERIALS AS ADHESIVES

To provide a shield film that is used for a shielded printed wiring board including a ground member, and is less likely to be displaced between a conductive protrusion or a conductive filler of a ground member and a shield layer and the shield layer of a shield film when a component is mounted by repeatedly heating and cooling a shielded printed wiring boar.SOLUTION: A shield film according to the present invention includes a shield layer and an insulating layer laminated on the shield layer, and a first low melting point metal layer is formed on at least a part between the shield layer and the insulating layer.SELECTED DRAWING: Figure 1 【課題】 本発明は、グランド部材を備えるシールドプリント配線板に用いられるシールドフィルムであって、該シールドプリント配線板に加熱及び冷却を繰り返して部品を実装する際に、グランド部材の導電性突起又は導電性フィラーとシールドフィルムのシールド層との間にずれが生じにくいシールドフィルムを提供することを目的とする。【解決手段】 本発明のシールドフィルムは、シールド層と、上記シールド層に積層された絶縁層とからなるシールドフィルムであって、上記シールド層と上記絶縁層との間の少なくとも一部には、第１低融点金属層が形成されていることを特徴とする。【選択図】 図１