SEMICONDUCTOR DEVICE

• Main Authors: ISE KOTA, SAITO MITSUTOSHI
• Format: Patent
• Language: English; Japanese
• Published: 04.06.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a semiconductor device capable of suppressing positional deviation of a connection lead.SOLUTION: A semiconductor device A1 comprises: a semiconductor element including a first electrode and a second electrode which are disposed on faces mutually directed to opposite sides in a (z) direction; a first lead to which the first electrode is joined; a second lead which is conducted with the second electrode; and a connection lead 3 including an element connection part 31 which is joined to the second electrode, and a lead connection part 32 which is joined to the second lead 2 by a solder 9. The lead connection part 32 includes: a lead connection part first face 321 which is directed to the side of the semiconductor element in a (y) direction; and a lead connection part second face 322 which is directed to an opposite side thereof. The second lead 2 includes a connection part recess 24 which includes a recess first side face 242 opposed to the lead connection part second face 322 and opened at the side of the semiconductor element. An area of a second contact region S2 between the lead connection part second face 322 and the solder 9 is larger than an area of a first contact region S1 between the lead connection part first face 321 and the solder 9.SELECTED DRAWING: Figure 10 【課題】接続リードの位置ずれを抑制できる半導体装置を提供する。【解決手段】半導体装置Ａ１において、ｚ方向において互いに反対側を向く面にそれぞれ配置された第１電極および第２電極を有する半導体素子と、第１電極が接合された第１リードと、第２電極と導通する第２リード２と、第２電極に接合された素子接続部３１、および、はんだ９によって第２リード２に接合されたリード接続部３２を有する接続リード３とを備えた。リード接続部３２は、ｙ方向において、半導体素子側を向くリード接続部第１面３２１と、その反対側を向くリード接続部第２面３２２とを備える。第２リード２は、リード接続部第２面３２２に対向する凹部第１側面２４２を有し、かつ、半導体素子側が開放された接続部凹部２４を備える。リード接続部第２面３２２とはんだ９との第２接触領域Ｓ２の面積が、リード接続部第１面３２１とはんだ９との第１接触領域Ｓ１の面積より大きい。【選択図】図１０