PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND THERMAL CONDUCTIVE SHEET
To solve a problem in which it is difficult to achieve both thermal conductivity and the effect of suppressing unnecessary radiation noise in a heat conductive member containing a magnetic material.SOLUTION: A printed circuit board according to an embodiment of the present invention includes a print...
Saved in:
Main Authors | , , , , , |
---|---|
Format | Patent |
Language | English Japanese |
Published |
04.06.2020
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | To solve a problem in which it is difficult to achieve both thermal conductivity and the effect of suppressing unnecessary radiation noise in a heat conductive member containing a magnetic material.SOLUTION: A printed circuit board according to an embodiment of the present invention includes a printed wiring board having a mounting surface facing a first side, an electronic element disposed on the mounting surface, a heat dissipation member disposed on the first side with respect to the electronic element and thermally connected to the electronic element, a heat conduction member disposed between the electronic element and the heat dissipation member, and the heat conduction member includes a first magnetic body-containing layer that includes a plurality of first magnetic bodies oriented along the first orientation direction, and a second magnetic body-containing layer that includes a plurality of second magnetic bodies oriented along the second orientation direction and having different postures from the first magnetic bodies, and the first magnetic body-containing layer and the second magnetic body-containing layer are arranged so as to overlap in a predetermined direction perpendicular to the mounting surface, and the first orientation direction is a direction along the predetermined direction.SELECTED DRAWING: Figure 2
【課題】磁性体を含む熱伝導部材において、熱伝導性と不要輻射ノイズの抑制効果とを両立することが困難な問題があった。【解決手段】本発明のプリント回路板の一つの態様は、第1の側を向く実装面を有するプリント配線板と、実装面に設けられた電子素子と、電子素子に対して第1の側に配置され、電子素子に対して熱的に接続された放熱部材と、電子素子と放熱部材との間に配置された熱伝導部材と、を備え、熱伝導部材は、第1配向方向に沿って配向された複数の第1磁性体を内部に含む第1磁性体含有層と、第2配向方向に沿って配向され第1磁性体とは姿勢が異なる複数の第2磁性体を内部に含む第2磁性体含有層と、を有し、第1磁性体含有層と第2磁性体含有層とは、実装面に垂直な所定方向に重ねて配置され、第1配向方向は、所定方向に沿った方向であることを特徴とする。【選択図】図2 |
---|---|
Bibliography: | Application Number: JP20180224781 |