RESIN MULTILAYER SUBSTRATE AND ELECTRONIC APPARATUS

• Main Author: KAMATA AKIFUMI
• Format: Patent
• Language: English; Japanese
• Published: 04.06.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To realize resin multilayer substrate in which change of electrical characteristics, resulting from breakdown of a conductor pattern is restrained when external force is applied, in a configuration including a resin base material, a conductor pattern formed on the resin base material, and a protective layer formed on the surface of the resin base material.SOLUTION: A resin multilayer substrate 101 includes a resin base material 30 having a first principal surface VS1 and a second principal surface VS2 facing each other, mounting electrodes P1, P2 formed only on the first principal surface VS1, a protective layer 2 formed on the second principal surface VS2, and conductor patterns 41, 42, 43 formed on the resin base material 30. The resin base material 30 is formed to include multiple first resin layers 11, 12, 13, 14, and the protective layer 2 is composed of insulation resin harder than the resin material of the first resin layer 14 having the second principal surface VS2. The conductor patterns 41, 42, 43 are formed on portions other than the boundary surface of the second principal surface VS2 and the protective layer 2, and other than the protective layer 2.SELECTED DRAWING: Figure 1 【課題】樹脂基材と、樹脂基材に形成される導体パターンと、樹脂基材の表面に形成される保護層と、を備える構成において、外力が加わった際の上記導体パターンの損傷に起因する電気的特性の変化を抑制した、樹脂多層基板を実現する。【解決手段】樹脂多層基板１０１は、互いに対向する第１主面ＶＳ１および第２主面ＶＳ２を有する樹脂基材３０と、第１主面ＶＳ１のみに形成される実装電極Ｐ１，Ｐ２と、第２主面ＶＳ２に形成される保護層２と、樹脂基材３０に形成される導体パターン４１，４２，４３と、を備える。樹脂基材３０は複数の第１樹脂層１１，１２，１３，１４を含んで形成され、保護層２は、第２主面ＶＳ２を有する第１樹脂層１４の樹脂材料よりも硬質な絶縁樹脂からなる。導体パターン４１，４２，４３は、第２主面ＶＳ２と保護層２との界面以外、および保護層２以外に形成される。【選択図】図１