CONDUCTIVE SUBSTRATE WITH METAL WIRING AND MANUFACTURING METHOD OF CONDUCTIVE SUBSTRATE, AND METAL INK FOR METAL WIRING FORMATION

• Main Authors: SATO HIRONORI, KOSHIJI KENJIRO, MAKITA YUICHI, NAKAMURA NORIAKI, KASUGA MASATO, OSHIMA YUSUKE, KUBO HITOSHI
• Format: Patent
• Language: English; Japanese
• Published: 04.06.2020
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CONDUCTORS; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; INKS; INSULATORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS THEREFOR; WOODSTAINS

To provide a conductive substrate in which metal wiring is formed on a backing material, light reflex of the metal wiring is restrained, and existence of which is hard to see.SOLUTION: In a conductive substrate including a backing material and metal wiring composed of at least any one of silver and copper, an antireflection region is formed on the surface of some or all metal wiring. The antireflection region is composed of roughened particles of at least any one of silver and copper, and melanism particles finer than the roughened particles embedded between the roughened particles. The melanism particles is composed of silver or a silver compound, copper or a copper compound, or carbon or an organic material having carbon content rate of 25 wt% or more. The antireflection region has a centerline average roughness of the surface of 15-70 nm. The conductive substrate is manufactured by coating with melanism ink containing melanism particles, after forming the metal wiring of metal ink forming the roughened particles.SELECTED DRAWING: Figure 1 【課題】基材上に金属配線が形成された導電基板について、金属配線の光反射が抑制されており、その存在が視認され難いものを提供する。【解決手段】本発明は、基材と銀又は銅の少なくともいずれかよりなる金属配線とを備える導電基板に関する。この導電基板は、金属配線の一部又は全部の表面上に反射防止領域が形成されている。この反射防止領域は、銀又は銅の少なくともいずれかよりなる粗化粒子と、粗化粒子の間に埋設された粗化粒子より微細な黒化粒子とで構成される。黒化粒子は、銀又は銀化合物、銅又は銅化合物、若しくは、カーボン又は炭素含有率２５重量％以上の有機物よりなる。そして、反射防止領域は、表面の中心線平均粗さが１５ｎｍ以上７０ｎｍ以下となっている。本発明に係る導電基板は、粗化粒子を形成する金属インクで金属配線を形成した後、黒化粒子を含む黒化インクと塗布することで製造される。【選択図】図１