VIA WIRING FORMING SUBSTRATE, VIA WIRING FORMING SUBSTRATE MANUFACTURING METHOD, AND SEMICONDUCTOR CHIP MOUNTING METHOD

• Main Author: KURIHARA HIROYUKI
• Format: Patent
• Language: English; Japanese
• Published: 04.06.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a via wiring forming substrate which can simultaneously mount semiconductor chips having different heights without the need to make a columnar electrical connector in advance, a manufacturing method thereof, and a semiconductor mounting component manufactured using the same.SOLUTION: A vi...