IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD

• Main Author: ARAKAWA TATSUYA
• Format: Patent
• Language: English; Japanese
• Published: 21.05.2020
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

To provide an advantageous technique for simplifying a structure of an imprint apparatus while suppressing a decrease in throughput.SOLUTION: A process is performed including: a contact step of contacting an imprint material on a substrate with a mold; an alignment step of aligning the substrate and the mold; and a curing step of curing the imprint material. The apparatus includes: a first light source 121 for generating first light for deforming the substrate for alignment between the substrate and the mold; a second light source 122 for generating second light for partially curing the imprint material; and a spatial light modulator 133 for generating first modulated light obtained by modulating the first light and second modulated light obtained by modulating the second light. A first operation in which the first modulated light is supplied to an optical path to a substrate via the mold and the imprint material, a second operation in which the second modulated light is supplied to the optical path after the first operation; and a third operation of supplying the first modulated light to the optical path after the second operation are executed. The second operation and the third operation are executed in parallel with the alignment step.SELECTED DRAWING: Figure 2 【課題】スループットの低下を抑えつつインプリント装置の構造を単純化するために有利な技術を提供する。【解決手段】基板上のインプリント材と型とを接触させる接触工程と、基板と型とのアライメントを行うアライメント工程と、インプリント材を硬化させる硬化工程とを含む処理を実行する。装置は、基板と型とのアライメントのために基板を変形させる第１光を発生する第１光源１２１と、インプリント材を部分的に硬化させる第２光を発生する第２光源１２２と、第１光を変調した第１変調光および第２光を変調した第２変調光を発生する空間光変調器１３３とを備える。第１変調光が型およびインプリント材を介して基板に至る光路に供給される第１動作、第１動作の後に第２変調光が光路に供給される第２動作、第２動作の後に第１変調光が光路に供給される第３動作が実行され、第２動作および第３動作は、アライメント工程と並行して実行される。【選択図】図２