SEMICONDUCTOR DEVICE

To provide a semiconductor device which can easily eliminate the situation where bubbles are present between an electrode and a case.SOLUTION: A semiconductor device 100 includes a case Cs1 surrounding a region Rg1 filled with a sealing material 4. The case Cs1 is made of resin. An electrode E1 is f...

Full description

Saved in:
Bibliographic Details
Main Authors GOTO AKIRA, HARADA SEIGO, OHARA MARIKO
Format Patent
LanguageEnglish
Japanese
Published 21.05.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:To provide a semiconductor device which can easily eliminate the situation where bubbles are present between an electrode and a case.SOLUTION: A semiconductor device 100 includes a case Cs1 surrounding a region Rg1 filled with a sealing material 4. The case Cs1 is made of resin. An electrode E1 is fixed to the case Cs1. A local portion E1x that is a part of the electrode E1 is provided with a notch V1 that exposes a part of the resin that forms the case Cs1 to the region Rg1.SELECTED DRAWING: Figure 1 【課題】電極とケースとの間に気泡が存在する状況を解消しやすい半導体装置を提供する。【解決手段】半導体装置１００は、封止材４が充填されている領域Ｒｇ１を囲むケースＣｓ１を備える。ケースＣｓ１は、樹脂で構成されている。ケースＣｓ１には、電極Ｅ１が固定されている。電極Ｅ１の一部である局部Ｅ１ｘには、ケースＣｓ１を構成する樹脂の一部を領域Ｒｇ１に露出させる切り欠きＶ１が設けられている。【選択図】図１
Bibliography:Application Number: JP20180209421