METAL TERMINAL WITH SOLDER CHIP AND MANUFACTURING METHOD OF GLASS PLATE WITH THE METAL TERMINAL

• Main Authors: YAMAGUCHI MASATOSHI, KUWABARA YOSHIYUKI, YUKI SHINICHIRO
• Format: Patent
• Language: English; Japanese
• Published: 21.05.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CURRENT COLLECTORS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a metal terminal with a solder chip, in which fusion of the solder chip can be easily detected, and provide a manufacturing method of a glass plate with the metal terminal.SOLUTION: A metal terminal with a solder chip is provided which is electrically connected to a conductive film formed on a glass plate, and the metal terminal with a solder chip comprises: a pedestal part; a solder chip provided in a first surface of the pedestal part, the first surface being opposite to the conductive film; and a wiring connection part coupled to the pedestal part. The thickness of the solder chip is 0.7 mm to 3.0 mm.SELECTED DRAWING: Figure 5 【課題】半田チップの溶融の検出が容易な、半田チップ付き金属端子、及び金属端子付きガラス板の製造方法を提供する。【解決手段】ガラス板に形成される導電膜に電気的に接続される半田チップ付き金属端子であって、半田チップ付き金属端子は、台座部と、導電膜と対向する台座部の第１面に設けられる半田チップと、台座部に連結される配線接続部と、を備え、半田チップの厚みが０．７ｍｍ〜３．０ｍｍである。【選択図】図５