POLYIMIDE FILM

• Main Authors: ECHIGO YOSHIAKI, SUGIMOTO YOSUKE, SHIGETA AKIRA, YOSHIDA TAKESHI, YAMADA HIROKI, TAKEUCHI KO
• Format: Patent
• Language: English; Japanese
• Published: 21.05.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

To provide a polyimide film having excellent dielectric properties and excellent solvent resistance, a laminate polyimide film, and a flexible copper-clad laminate.SOLUTION: A solvent insoluble polyimide film that uses a dimer diamine of more than 15 mol% to less than 50 mol% relative to all the total diamine components. A laminate film composed of the solvent insoluble polyimide film and a non-thermoplastic polyimide film. A flexible copper-clad laminate composed of the laminate polyimide film and a copper foil.SELECTED DRAWING: None 【課題】誘電特性に優れ、しかも耐溶剤性にすぐれたポリイミドフィルム、積層ポリイミドフィルム、フレキシブル銅張積層板を提供する。【解決手段】＜１＞ ダイマジアミンを全ジアミン成分に対し１５モル％超、５０モル％未満用いた、溶媒不溶性ポリイミドフィルム。＜２＞ 前記溶媒不溶性ポリイミドフィルムと非熱可塑性ポリイミドフィルムとからなる積層フィルム。＜３＞ 前記積層ポリイミドフィルムと銅箔とからなるフレキシブル銅張積層板。【選択図】なし