COMPOSITION FOR FILM FORMATION, GLASS SUBSTRATE COATED WITH THE COMPOSITION FOR FILM FORMATION, AND TOUCH PANEL USING THE GLASS SUBSTRATE

To provide a composition for film formation, which has excellent stability during storage and developability and, by coating and forming a cured film, forms a film having excellent adhesivity to a light transmissive substrate and electrodes as well as transparency, and a high insulation property eve...

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Main Authors OKAMOTO KATSUTOSHI, NAKANO TADASHI, IKEDO KEISUKE, MATSUOKA YUTAKA
Format Patent
LanguageEnglish
Japanese
Published 21.05.2020
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Summary:To provide a composition for film formation, which has excellent stability during storage and developability and, by coating and forming a cured film, forms a film having excellent adhesivity to a light transmissive substrate and electrodes as well as transparency, and a high insulation property even when being a thin film.SOLUTION: Provided is a composition for film formation, comprising a polysiloxane compound which satisfies the following condition 1, a polythiol compound which does not contain silicon in the molecule, a polymerization initiator, and an organic solvent. Materials which constitute the polysiloxane compound include a silane compound (A) which is at least one selected from a group of tetraalkoxysilanes and bis(trialkoxysilyl)alkanes, a silane compound (B) which is at least one selected from the group of alkyltrialkoxysilanes, dialkyldialkoxysilanes, cycloalkyltrialkoxysilanes, trialkoxysilanes, and phenyltrialkoxy silanes, and silane compounds (C) having a radically polymerizable unsaturated double bond.SELECTED DRAWING: None 【課題】保存の間の安定性及び現像性に優れ、塗工して硬化皮膜を形成することにより、透光性基板や電極との密着性及び透明性に優れ、薄膜でも高い絶縁性を有する皮膜形成用組成物を提供することを目的とする。【解決手段】本発明は、下記の条件1を満足するポリシロキサン化合物、分子内にケイ素を含まないポリチオール化合物、重合開始剤及び有機溶剤を含有することを特徴とする皮膜形成用組成物に関する。上記ポリシロキサン化合物を構成する材料として、テトラアルコキシシラン及びビス(トリアルコキシシリル)アルカンの群から選択される少なくとも1種であるシラン系化合物(A)と、アルキルトリアルコキシシラン、ジアルキルジアルコキシシラン、シクロアルキルトリアルコキシシラン、ビニルトリアルコキシシラン、フェニルトリアルコキシシランの群から選択される少なくとも1種であるシラン系化合物(B)と、ラジカル重合性不飽和二重結合を有するシラン系化合物(C)とを含む。【選択図】なし
Bibliography:Application Number: JP20180209668