LAMINATE, METHOD FOR PRODUCING AND USING THE SAME, AND POLYIMIDE PRECURSOR SOLUTION FOR LAMINATING GLASS SUBSTRATE

• Main Authors: MORIKITA TATSUYA, ECHIGO YOSHIAKI, YAMADA MUNENORI, SHIGETA AKIRA, YOSHIDA TAKESHI, YAMADA HIROKI
• Format: Patent
• Language: English; Japanese
• Published: 14.05.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide a laminate composed of a polyimide coating layer and a glass substrate, having good peeling characteristics when peeling the polyimide coating layer from the glass substrate, and not allowing the peeled polyimide coating layer to be easily curled.SOLUTION: The present invention relates to a laminate composed of a glass substrate and a polyimide coating layer formed on the glass substrate and containing a filler-containing polyimide layer, in which a thermal expansion coefficient of the filler is 10 ppm/°C or less.SELECTED DRAWING: None 【課題】本発明は、ポリイミド被膜とガラス基板とからなる積層体において、ポリイミド被膜をガラス基板から剥離する際、良好な剥離特性を有し、かつ剥離されたポリイミド被膜がカールしにくい積層体の提供を目的とする。【解決手段】本発明は、ガラス基板と、このガラス基板上に形成されたフィラ含有ポリイミド層を含むポリイミド被膜とからなる積層体であって、フィラの熱膨張係数が１０ｐｐｍ／℃以下であることを特徴とする積層体に関する。【選択図】なし