POWER CONVERSION DEVICE

To estimate a temperature of a semiconductor device on the basis of a temporal change of a gate voltage of the semiconductor device without using a temperature sensor.SOLUTION: A power conversion device comprises: a plurality of MOSFET 1a and MOSFET 1b including a MOS gate structure controlling curr...

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Bibliographic Details
Main Authors OGAWA TAKASHI, SAKURAI NAOKI
Format Patent
LanguageEnglish
Japanese
Published 07.05.2020
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Summary:To estimate a temperature of a semiconductor device on the basis of a temporal change of a gate voltage of the semiconductor device without using a temperature sensor.SOLUTION: A power conversion device comprises: a plurality of MOSFET 1a and MOSFET 1b including a MOS gate structure controlling current; a plurality of current sensors 16 which measure a load current of a load connected to each MOSFET; a gate driving circuit which controls a switching operation of each MOSFET; a gate voltage temporal change measuring circuit which measures temporal changes of gate voltage at each MOSFET switching operation; a memory 15 which stores temperature dependence information indicating a relationship between the temporal changes of gate voltage at each MOSFET switching operation and a temperature of each MOSFET in association with the load current; and an arithmetic circuit which references the temperature dependence information stored in the memory and estimates at least one temperature of the plurality of MOSFETs on the basis of the load current measured by the current sensor and measurement results of the gate voltage temporal change measuring circuit.SELECTED DRAWING: Figure 1 【課題】温度センサを用いることなく、半導体デバイスのゲート電圧の時間変化を基に半導体デバイスの温度を推定する。【解決手段】電力変換装置は、電流を制御するMOSゲート構造を有する複数のMOSFET1a、1bと、各MOSFETに接続される負荷の負荷電流を測定する複数の電流センサ16と、各MOSFETのスイッチング動作を制御するゲート駆動回路と、各MOSFETのスイッチング動作時におけるゲート電圧の時間変化を測定するゲート電圧時間変化測定回路と、各MOSFETのスイッチング動作時におけるゲート電圧の時間変化と各MOSFETの温度との関係を示す温度依存性情報を負荷電流に関連づけて記憶するメモリ15と、電流センサの測定による負荷電流とゲート電圧時間変化測定回路の測定結果を基に、メモリに記憶された温度依存性情報を参照し、複数のMOSFETのうち少なくとも一つの温度を推定する演算回路と、を有する。【選択図】図1
Bibliography:Application Number: JP20180205466