PROXIMITY SENSOR PACKAGE, PROXIMITY SENSOR DEVICE, AND ELECTRONIC MODULE

• Main Author: ONIZUKA YOSHITOMO
• Format: Patent
• Language: English; Japanese
• Published: 07.05.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a proximity sensor package or the like that can further reduce the size of a proximity sensor device used in a mobile terminal such as a mobile phone or a smartphone.SOLUTION: A proximity sensor package according to the present invention includes a main surface 102, includes a wiring board 100 in which a first recess 104 that is located on the main surface 102, and in which a light emitting element 106 is mounted on a first mounting portion 104a, and a second recessed portion 105 in which a light receiving element 107 is mounted on a second mounting portion 105a are located, the second mounting portion 105a is rectangular in plan view, and the first recess 104 is located on the corner side of the second mounting portion 105a, and in plan view, a wall portion 110 between the first recess 104 and the second recess 105 includes a curved portion 111.SELECTED DRAWING: Figure 1 【課題】 携帯電話、スマートフォン等の携帯端末に使用される近接センサ装置のさらなる小型化を図ることが可能な近接センサ用パッケージ等を提供すること。【解決手段】 本発明の近接センサ用パッケージは、主面102を有しており、主面102に位置し、発光素子106が第１搭載部104ａに搭載される第１凹部104、および受光素子107が第２搭載部105ａに搭載される第２凹部105が位置した配線基板100を含み、平面視で第２搭載部105ａが方形状であり、第１凹部104が第２搭載部105ａの角部側に位置しており、平面視において、第１凹部104と第２凹部105との間の壁部110が曲部111を有している。【選択図】 図１