SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM

• Main Authors: KAWABUCHI YOSUKE, IKEDA KYOKO
• Format: Patent
• Language: English; Japanese
• Published: 30.04.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To prevent a pattern from collapsing when a drying liquid is removed from a substrate surface.SOLUTION: A substrate processing apparatus includes: a substrate holding part configured to hold a substrate; a drying liquid supply part configured to supply a drying liquid toward a surface of the substrate held by the substrate holding part; a temperature adjustment part configured to change a temperature of the surface of the substrate; and a controller configured to control the temperature adjustment part. The controller controls the temperature adjustment part so as to generate a temperature difference in a liquid film of the drying liquid supplied onto the surface of the substrate.SELECTED DRAWING: Figure 4 【課題】基板表面からの乾燥液の除去時のパターン破損を防ぐ。【解決手段】基板処理装置は、基板を保持する基板保持部と、基板保持部により保持された基板の表面に対して乾燥液を供給する乾燥液供給部と、基板の表面温度を変化させる温度調整部と、温度調整部を制御する制御部とを含む。制御部は、基板の表面に供給されている乾燥液の液膜に温度差を生じさせるように温度調整部を制御する。【選択図】図４