PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND HEAT CONDUCTION SHEET

• Main Authors: KAWAGUCHI YASUHIRO, MITSUYA KENSUKE, MATSUZAKI TORU, ITO MASAAKI, SAITO MASAHIRO, OMORI TOSHIYUKI
• Format: Patent
• Language: English; Japanese
• Published: 30.04.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To solve a problem that the number of components of a printed circuit board is increased and the printed circuit board is enlarged when shielding unnecessary radiation noise by surrounding the entire electronic element with a shield case or the like.SOLUTION: An aspect of a printed circuit board of the present invention includes: a print wiring board having a mounting surface facing a first side; an electronic element provided on the mounting surface, a heat dissipation member arranged on the first side with respect to the electronic element and thermally connected to the electronic element; and a heat conduction member arranged between the electronic element and the heat dissipation member. The heat conduction member includes a high relative magnetic permeability portion including a magnetic material and a low relative magnetic permeability portion having a relative magnetic permeability lower than a relative magnetic permeability of the high relative magnetic permeability portion.SELECTED DRAWING: Figure 2 【課題】シールドケース等によって電子素子全体を囲むことで不要輻射ノイズを遮蔽する場合、プリント回路板の部品点数が増加する、プリント回路板が大型化する等の問題があった。【解決手段】本発明のプリント回路板の一つの態様は、第１の側を向く実装面を有するプリント配線板と、実装面に設けられた電子素子と、電子素子に対して第１の側に配置され、電子素子に対して熱的に接続された放熱部材と、電子素子と放熱部材との間に配置された熱伝導部材と、を備え、熱伝導部材は、磁性体を含む高比透磁率部と、高比透磁率部の比誘電率よりも小さい比誘電率を有する低比誘電率部と、を有することを特徴とする。【選択図】図２