ELECTRONIC COMPONENT MODULE, ELECTRIC CONNECTION BOX, AND WIRE HARNESS

To provide an electronic component module capable of suppressing a temperature rise, and to also provide an electric connection box or a wire harness which is configured by comprising the electronic component module.SOLUTION: An electronic component module 1 is configured by comprising: a substrate...

Full description

Saved in:
Bibliographic Details
Main Authors NAKAYAMA TAKUYA, YAGI TOSHIHISA, ISAKA NAOKI
Format Patent
LanguageEnglish
Japanese
Published 23.04.2020
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:To provide an electronic component module capable of suppressing a temperature rise, and to also provide an electric connection box or a wire harness which is configured by comprising the electronic component module.SOLUTION: An electronic component module 1 is configured by comprising: a substrate 36 on which a relay 42hot that is an electric heating body is mounted; a box-shaped cover 2 in which the entire substrate 36 is accommodated; and a connector block 47 integrally including a connector 37 to be a connection destination of an external mating connector. The cover 2 includes a housing insertion hole 8. The housing insertion hole 8 is a portion for exposing a housing 49 of the connector 37 outsides. The substrate 36 includes a metallic heat radiation bus bar 43 extending from the vicinity of the relay 42hot to a connection side of the connector 37. Heat generated by the relay 42hot is conducted upwards by the heat radiation bus bar 43 and radiated to the outside by air passing a clearance between the housing insertion hole 8 and the housing 49.SELECTED DRAWING: Figure 8 【課題】温度上昇を抑制することが可能な電子部品モジュールを提供する。また、この電子部品モジュールを備えて構成される電気接続箱やワイヤハーネスも提供する。【解決手段】電子部品モジュール1は、発熱体であるリレー42hotが実装された基板36と、この基板36の全体を収容する箱形状のカバー2と、外部の相手コネクタの接続先になるコネクタ37を一体に有するコネクタブロック47とを備えて構成される。カバー2は、ハウジング挿通孔8を有する。このハウジング挿通孔8は、コネクタ37のハウジング49を外部に露出させるための部分である。基板36は、リレー42hotの近傍からコネクタ37の接続側に向けてのびる金属製の放熱バスバー43を有する。リレー42hotにより生じる熱は、放熱バスバー43にて上方に伝えられ且つハウジング挿通孔8とハウジング49との隙間を通過する空気にて外部に放出される。【選択図】図8
Bibliography:Application Number: JP20180194449