METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

• Main Authors: TAKAHAGI SATOSHI, KADOGUCHI TAKUYA
• Format: Patent
• Language: English; Japanese
• Published: 23.04.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To prevent scattering of a solder droplet due to rupture of a void.SOLUTION: A method of manufacturing a semiconductor element comprises a first reflow process and a second reflow process. At the first reflow process, a solder material is molten and resolidified under a first pressure lower than an...