METHOD AND APPARATUS FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT

• Main Authors: OGAWA TAKASHI, TAKAHASHI RYOTA
• Format: Patent
• Language: English; Japanese
• Published: 23.04.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY

To provide a method and an apparatus for manufacturing a ceramic electronic component capable of preventing a short circuit defect of an internal electrode on a cut surface of a laminated body.SOLUTION: A method for manufacturing a ceramic electronic component includes a step of preparing a laminated sheet having a uniaxially laminated ceramic sheets and an internal electrode arranged between the ceramic sheets, a step of cutting the laminated sheet into a laminated chip by using a cutting blade 20 having a tip portion 204 constituted by a convex curved surface in a uniaxial direction, and a step of providing a side margin portion on a side surface of the multilayer chip where the internal electrode is exposed.SELECTED DRAWING: Figure 11 【課題】積層体の切断面において内部電極の短絡不良を防止することが可能なセラミック電子部品の製造方法及びその製造装置を提供する。【解決手段】積層セラミック電子部品の製造方法は、一軸方向に積層されたセラミックシートと、上記セラミックシートの間に配置された内部電極と、を有する積層シートを準備する工程と、一軸方向に凸な曲面で構成された先端部２０４を有する切断刃２０を用いて、上記積層シートを切断し積層チップとする工程と、上記積層チップの内部電極が露出する側面にサイドマージン部を設ける工程とを含む。【選択図】図１１