TERMINAL MATERIAL FOR CONNECTOR, TERMINAL FOR CONNECTOR, AND MANUFACTURING METHOD OF TERMINAL MATERIAL FOR CONNECTOR

• Main Authors: TARUTANI YOSHIE, NAKAYA KIYOTAKA
• Format: Patent
• Language: English; Japanese
• Published: 09.04.2020
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CURRENT COLLECTORS; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; LINE CONNECTORS; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

To provide a terminal material for connector capable of enhancing abrasion resistance and heat resistance, a terminal for connector, and a manufacturing method of the terminal material for connector.SOLUTION: The terminal material for connector has a substrate consisting of copper or copper alloy, and a silver tin plating layer consisting of silver tin alloy coated on at least a part of a surface of the substrate, in which the silver tin plating layer contains Ag in a range of 70 at% to 85 at% and mainly contains a silver tin-based intermetallic compound, and average particle diameter of the silver tin plating layer measured by EBSD after heating the silver tin plating layer at 150°C for 250 hr. is 1 μm or less.SELECTED DRAWING: Figure 1 【課題】耐摩耗性及び耐熱性を向上できるコネクタ用端子材、コネクタ用端子及びコネクタ用端子材の製造方法を提供すること。【解決手段】本発明のコネクタ用端子材は、銅又は銅合金からなる基材と、該基材の表面の少なくとも一部に被覆された銀錫合金からなる銀錫めっき層と、を備え、銀錫めっき層は、Ａｇを７０ａｔ％以上８５ａｔ％以下の範囲で含み、かつ、銀錫系金属間化合物を主成分とし、銀錫めっき層を１５０℃で２５０時間加熱後にＥＢＳＤで測定した該銀錫めっき層の結晶粒の平均粒径が１μｍ以下である。【選択図】図１