TERMINAL MATERIAL FOR CONNECTOR, TERMINAL FOR CONNECTOR, AND MANUFACTURING METHOD OF TERMINAL MATERIAL FOR CONNECTOR

• Main Authors: TARUTANI YOSHIE, NAKAYA KIYOTAKA
• Format: Patent
• Language: English; Japanese
• Published: 09.04.2020
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CURRENT COLLECTORS; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; LINE CONNECTORS; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

To provide a terminal material for connector capable of enhancing abrasion resistance and heat resistance, a terminal for connector, and a manufacturing method of the terminal material for connector.SOLUTION: The terminal material for connector has a reflow tin material having a substrate consisting of copper or copper alloy and a reflow tin layer coated on a surface of the substrate, in which a part of a surface of the reflow tin material is coated by a silver tin plating layer consisting of silver tin alloy, the silver tin plating layer contains Ag in a range of 70 at% to 85 at%, mainly contains a silver tin-based intermetallic compound, average particle diameter of the silver tin plating layer measured by EBSD after heating the silver tin plating layer at 150°C for 250 hr. is 1 μm or less, and an intermetallic compound mainly containing NiSnis arranged between the silver tin plating layer and the reflow tin material.SELECTED DRAWING: Figure 1 【課題】耐摩耗性及び耐熱性を向上できるコネクタ用端子材、コネクタ用端子及びコネクタ用端子材の製造方法を提供すること。【解決手段】本発明のコネクタ用端子材は、銅又は銅合金からなる基材と該基材の表面に被覆されたリフロー錫層とを備えるリフロー錫材を有し、リフロー錫材の表面の一部には、銀錫合金からなる銀錫めっき層が被覆され、銀錫めっき層は、Ａｇを７０ａｔ％以上８５ａｔ％以下の範囲で含み、かつ、銀錫系金属間化合物を主成分とし、銀錫めっき層を１５０℃で２５０時間加熱後にＥＢＳＤで測定した該銀錫めっき層の結晶粒の平均粒径が１μｍ以下であり、銀錫めっき層とリフロー錫材との間には、ＮｉＳｎ４を主成分とする金属間化合物が配置されている。【選択図】図１