COMBINATION METAL MASK PLATE AND METHOD FOR MANUFACTURING THE SAME
To provide: a combination metal mask plate used when highly accurately printing electrodes and wiring or the like of silicon wafers, printed wiring boards and various electronic components, when mounting conductive balls, and when depositing organic ELs or the like; and a method for manufacturing th...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
09.04.2020
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Subjects | |
Online Access | Get full text |
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Summary: | To provide: a combination metal mask plate used when highly accurately printing electrodes and wiring or the like of silicon wafers, printed wiring boards and various electronic components, when mounting conductive balls, and when depositing organic ELs or the like; and a method for manufacturing the combination metal mask plate.SOLUTION: A combination metal mask plate includes a metal mask 2, a support screen bonded so as to be overlapped with a metal mask outer peripheral part, and a plate frame 1 for stretching the support screen. A screen width region of the support screen is designed to fall within an adhesive part 6.SELECTED DRAWING: Figure 2
【課題】シリコンウェーハ、プリント配線基板、各種電子部品の電極や配線等を高精度に印刷する場合や、導電性ボールを搭載する場合、有機EL等を蒸着する場合に使用するコンビネーションメタルマスク版及びその製造方法の提供。【解決手段】メタルマスク2と、前記メタルマスク外周部と重なるように接合される支持体スクリーンと、前記支持体スクリーンを張設する版枠1とを有するコンビネーションメタルマスク版において、支持体スクリーンのスクリーン幅領域が接着部6のみとなるようにしたコンビネーションメタルマスク版【選択図】図2 |
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Bibliography: | Application Number: JP20180185447 |