SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE

• Main Authors: USUKURA SHINICHI, EIZAI HIROSHI, YOSHIZAWA SHINJI, IWABUCHI MITSURU
• Format: Patent
• Language: English; Japanese
• Published: 09.04.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a solder composition in which voids can be sufficiently suppressed.SOLUTION: A solder composition contains (A) a rosin-based resin, (B) an activator, (C) a flux composition containing a solvent and (D) solder powder having a melting point of 200°C or higher and 250°C or lower, in which the component (B) contains at least one selected from the group consisting of (B1) an aromatic carboxylic acid having a hydroxyl group only in an ortho-position or a pros-position, (B2) a dicarboxylic acid having an alkylene group and 2 to 8 carbon atoms and (B3) a monocarboxylic acid having an alkyl group and 2 to 8 carbon atoms, and the component (C) contains (C1) diol having a boiling point of 220°C or higher and 250°C or lower or diacetate of diol.SELECTED DRAWING: None 【課題】ボイドを十分に抑制できるはんだ組成物を提供すること。【解決手段】本発明のはんだ組成物は、（Ａ）ロジン系樹脂、（Ｂ）活性剤および（Ｃ）溶剤を含有するフラックス組成物と、（Ｄ）融点が２００℃以上２５０℃以下であるはんだ粉末とを含有し、前記（Ｂ）成分が、（Ｂ１）オルト位またはプロス位のみに水酸基を有する芳香族カルボン酸、（Ｂ２）アルキレン基を有し、炭素数が２〜８のジカルボン酸、および、（Ｂ３）アルキル基を有し、炭素数が２〜８のモノカルボン酸からなる群から選択される少なくとも１種を含有し、前記（Ｃ）成分が、（Ｃ１）沸点が２２０℃以上２５０℃以下である、ジオール、または、ジオールのジアセテートを含有することを特徴とするものである。【選択図】なし