SEMICONDUCTOR DEVICE
To provide a technique capable of restraining deterioration due to heat of other circuit component, wile improving radiation performance.SOLUTION: In a lamination unit 11, multiple substitute condensers 13 sandwiches the electrode part 53 of a P bus bar connected with a capacitor CS and a positive e...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
02.04.2020
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a technique capable of restraining deterioration due to heat of other circuit component, wile improving radiation performance.SOLUTION: In a lamination unit 11, multiple substitute condensers 13 sandwiches the electrode part 53 of a P bus bar connected with a capacitor CS and a positive electrode terminal 21p, or the like of a power card 21, or the like while superposing, in conjunction with adjoining other substitute condensers 13. The electrode part 63 of an N bus bar 60 connected with the capacitor CS and a negative electrode terminal 21n, or the like of the power card 21, or the like are also sandwiched while being superposed. Furthermore, the electrode part 73 of an O bus bar 70 and the output terminal 21o, or the like of the power card 21, or the like, are sandwiched while being superposed. Since the positive electrode terminal 21p, or the like of the power card 21, or the like, and the electrode part 53, or the like, of the P bus bar are sandwiched between adjoining substitute condensers 13 and compressed from both sides by means of the substitute condensers 13, they are electrically connected without requiring weldment.SELECTED DRAWING: Figure 2
【課題】放熱性能を向上しつつ他の回路部品の熱による劣化を抑制し得る技術を提供する。【解決手段】本明細書で開示する積層ユニット11では、複数のサブ冷却器13は、隣り合う他のサブ冷却器13と共に、コンデンサCSに接続されているPバスバの電極部53とパワーカード21等の正極端子21p等とを重ねて挟み込む。また、コンデンサCSに接続されているNバスバ60の電極部63とパワーカード21等の負極端子21n等とを重ねて挟み込む。さらに、Oバスバ70の電極部73とパワーカード21等の出力端子21o等を重ねて挟み込む。これにより、パワーカード21等の正極端子21p等とPバスバの電極部53等は、いずれも隣り合うサブ冷却器13の間に挟み込まれて夫々の両側からサブ冷却器13により加圧されるため、溶接などを行わなくても、電気的に接続される。【選択図】図2 |
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Bibliography: | Application Number: JP20180180376 |