PICKUP TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

To provide a pickup tool capable of preventing a semiconductor chip from being destroyed by static electricity and a method of manufacturing a semiconductor module.SOLUTION: The pickup tool is capable of sucking a semiconductor chip. The pickup tool has a hole that opens on one end face and a plural...

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Bibliographic Details
Main Authors ASAGIRI SATOSHI, TOGASAKI TAKASHI
Format Patent
LanguageEnglish
Japanese
Published 02.04.2020
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Summary:To provide a pickup tool capable of preventing a semiconductor chip from being destroyed by static electricity and a method of manufacturing a semiconductor module.SOLUTION: The pickup tool is capable of sucking a semiconductor chip. The pickup tool has a hole that opens on one end face and a plurality of protrusions provided on the end face. When an area of the end face is denoted as S1 and the total area of tops of the protrusions is denoted as S2, the following expression is satisfied. 0.1%≤(S2/S1)×100≤1.0%.SELECTED DRAWING: Figure 2 【課題】半導体チップが静電気により破壊されるのを抑制することができるピックアップツール、および半導体モジュールの製造方法を提供することである。【解決手段】実施形態に係るピックアップツールは、半導体チップを吸着可能なピックアップツールである。ピックアップツールは、一方の端面に開口する孔と、前記端面に設けられた複数の凸部と、を有している。前記端面の面積をS1、前記複数の凸部の頂部の総面積をS2とした場合に、以下の式を満足する。0.1%≦(S2/S1)×100≦1.0%【選択図】図2
Bibliography:Application Number: JP20180178519