RESIN COMPOSITION FOR ENCAPSULATION, RELOCATED WAFER, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

• Main Authors: NAMIKI YUJI, IKEUCHI TAKATOSHI, MATSUNO TATSUYA
• Format: Patent
• Language: English; Japanese
• Published: 02.04.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide: a resin composition for encapsulation in which poor appearance on a surface of an encapsulating material after molding is suppressed while suppressing warpage of a support body after encapsulation; a relocated wafer and a semiconductor package obtained by using the same; and a manufacturing method of the semiconductor package in which warpage of the support body after encapsulation is suppressed and an appearance of the surface of the encapsulation material after molding is good.SOLUTION: The resin composition for encapsulation comprises a curable resin composition, an elastomer component, a coupling agent, and a filler, in which a content of the elastomer component is 1.0 mass% to 8.0 mass%. The resin composition satisfies at least one selected from a condition 1 and a condition 2, wherein the condition 1 is that a heating weight loss rate when the elastomer component is left in an environment of 150°C for one hour is 1.1 mass% or less, and the condition 2 is that a content of the coupling agent is 0.75 mass% or less of the total.SELECTED DRAWING: None 【課題】封止後の支持体の反りを抑制しつつ成形後の封止材表面における外観不良を抑制した封止用樹脂組成物、これを用いて得られる再配置ウエハ及び半導体パッケージ、並びに封止後の支持体の反りが抑制され、かつ成形後の封止材表面の外観が良好な半導体パッケージの製造方法の提供。【解決手段】硬化性樹脂成分と、エラストマ成分と、カップリング剤と、充填材と、を含み、前記エラストマ成分の含有率が全体の１．０質量％〜８．０質量％であり、条件１及び条件２から選ばれる少なくとも一方を満たす封止用樹脂組成物。ただし、条件１はエラストマ成分を１５０℃の環境中で１時間放置したときの加熱減量率が１．１質量％以下であることであり、条件２はカップリング剤の含有率が全体の０．７５質量％以下であることである。【選択図】なし