SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE

To provide a sealing resin composition, a cured product of which has low dielectric loss tangent.SOLUTION: A sealing resin composition contains an epoxy resin and a curing agent, the epoxy resin including an epoxy resin having an alicyclic structure, the curing agent having an active ester compound....

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Bibliographic Details
Main Authors YAMAURA ITARU, TANAKA MIKA, BABA TORU, KODAMA SHUNSUKE, SAITO TAKAHIRO
Format Patent
LanguageEnglish
Japanese
Published 02.04.2020
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:To provide a sealing resin composition, a cured product of which has low dielectric loss tangent.SOLUTION: A sealing resin composition contains an epoxy resin and a curing agent, the epoxy resin including an epoxy resin having an alicyclic structure, the curing agent having an active ester compound.SELECTED DRAWING: None 【課題】硬化物の誘電正接が低い封止用樹脂組成物を提供する。【解決手段】エポキシ樹脂と硬化剤とを含み、前記エポキシ樹脂は脂環構造を含有するエポキシ樹脂を含み、前記硬化剤は活性エステル化合物を含む、封止用樹脂組成物。【選択図】なし
Bibliography:Application Number: JP20180182760