THERMOPLASTIC RESIN FILM AND ELECTRIC/ELECTRONIC COMPONENT INCLUDING THE SAME

• Main Authors: YAMAUCHI HIDEYUKI, TAKAHASHI KENTA, WAKAHARA YOKO, AOYAMA SHIGERU
• Format: Patent
• Language: English; Japanese
• Published: 26.03.2020
• Subjects: LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; TRANSPORTING

To provide a thermoplastic resin film that is excellent in heat resistance, electric insulation and/or heat insulation.SOLUTION: A thermoplastic resin film has a polyarylene sulfide resin as the main component, including a multilayer structure of two layers or more, where at least one layer of them is a layer (I) having holes, and at least one side surface layer is a layer (II) with a surface roughness Ra of 1 μm or less.SELECTED DRAWING: None 【課題】耐熱性、電気絶縁性および／または断熱性に優れる熱可塑性樹脂フィルムを提供する。【解決手段】ポリアリーレンスルフィド樹脂を主成分としてなる熱可塑性樹脂フィルムであって、２層以上の積層構成を有し、構成する層の少なくとも１層は空孔を有する層（I）であり、少なくとも片面表層が表面粗さＲａが１μｍ以下の層（II）であることを特徴とする熱可塑性樹脂フィルム。【選択図】 なし