METHOD FOR MANUFACTURING LEAD-FREE SOLDER COMPOSITION

• Main Authors: JOSEPH C GONSALVES, ALEXANDRA M MACKIN, PEREORA JOHN, JENNIE S HWANG
• Format: Patent
• Language: English; Japanese
• Published: 19.03.2020
• Subjects: ALLOYS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; FERROUS OR NON-FERROUS ALLOYS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM

To provide a lead-free solder composition suited for use on glass and capable of withstanding use in high-temperature environment and also to provide an electrical connection structure using the composition.SOLUTION: A solder composition includes about 4 wt.% to about 25 wt.% of tin, about 0.1 wt.% to about 8 wt.% of antimony, about 0.03 wt.% to about 4 wt.% of copper, about 0.03 wt.% to about 4 wt.% of nickel, about 66 wt.% to about 90 wt.% of indium, and about 0.5 wt.% to about 9 wt.% of silver. The composition can further include about 0.2 wt.% to about 6 wt.% of zinc, and, independently, about 0.01 wt.% to about 0.3 wt.% of germanium. The composition can be used to solder an electric connector to an electric contact surface layer on a glass element.SELECTED DRAWING: None 【課題】ガラス上での使用に適し、高温環境での使用に耐える無鉛はんだ組成物及び、この組成物を利用した電気接続構造を提供する。【解決手段】はんだ組成物は、約４重量％〜約２５重量％のスズと、約０．１重量％〜約８重量％のアンチモンと、約０．０３重量％〜約４重量％の銅と、約０．０３重量％〜約４重量％のニッケルと、約６６重量％〜約９０重量％のインジウムと、約０．５重量％〜約９重量％の銀とを含む。この組成物は、さらに、約０．２重量％〜約６重量％の亜鉛と、独立して、約０．０１重量％〜約０．３重量％のゲルマニウムを含んでいてもよい。この組成物を使用し、ガラス素子上の電気コンタクト表面層に電気コネクタをはんだ付けすることができる。【選択図】なし