APPARATUS FOR MANUFACTURING SEMICONDUCTOR, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

• Main Authors: NOMURA KOTARO, HATASAKI KOJI
• Format: Patent
• Language: English; Japanese
• Published: 12.03.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide an apparatus for manufacturing a semiconductor, which allows for reduction of variation in a warpage amount of a semiconductor substrate.SOLUTION: A apparatus for manufacturing semiconductor 1 comprises: at least one or more ultraviolet light lamps 10 that are provided at a position facing a surface of a semiconductor substrate irradiated with ultraviolet light 11; and a shutter 20 that is arranged between the surface and the ultraviolet light lamps and that can shield the ultraviolet light irradiated from the ultraviolet light lamps. The shutter comprises: a first movable part that can be moved in a first direction being one of in-plane directions parallel to the semiconductor substrate; and a second movable part that can be moved, independently from the first movable part, in a second direction orthogonal to the first direction among the in-plane directions.SELECTED DRAWING: Figure 1 【課題】半導体基板の反り量のばらつきを低減することが可能な半導体製造装置を提供する。【解決手段】半導体製造装置１は、紫外線１１を照射する半導体基板の一面に対向する位置に設けられた少なくとも一つ以上の紫外線ランプ１０と、一面と紫外線ランプとの間に配置され、紫外線ランプから照射された紫外線を遮蔽可能なシャッター２０と、を備える。シャッターは、半導体基板に平行な面内方向の一つである第１方向に移動可能な第１可動部と、面内方向のうち第１方向に直交する第２方向に第１可動部とは独立して移動可能な第２可動部と、を有する。【選択図】図１