SEMICONDUCTOR DEVICE
To provide a semiconductor device which has excellent rupture prevention performance during short circuit current with a structure without using pressure-welding.SOLUTION: A semiconductor device includes a plurality of semiconductor element modules connected in parallel. Each of the semiconductor el...
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Main Authors | , , , , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
12.03.2020
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a semiconductor device which has excellent rupture prevention performance during short circuit current with a structure without using pressure-welding.SOLUTION: A semiconductor device includes a plurality of semiconductor element modules connected in parallel. Each of the semiconductor element modules SM1a and SM1b has at least one planar semiconductor element 40. A metallic member 20 in contact with one surface of the semiconductor element 40, a second metallic member 30 in contact with the other surface of the semiconductor element 40, and the semiconductor element 40 are laminated. A metallic reinforcing member 50 is provided to surround upper and lower sides in a lamination direction of the laminated metallic member 20, semiconductor element 40 and metallic member 30. The metallic member 30 and the metallic reinforcing member 50 are connected through a connection conductor 90. The connection conductor 90 has electrical resistivity larger than that of the second metallic member 30 or the metallic reinforcing member 50. A second connection conductor 95 connected to the metallic reinforcing member 50 has electrical resistivity larger than the metallic member 20 or the second metallic member 30.SELECTED DRAWING: Figure 9
【課題】圧接を用いない構造で、短絡電流時の破裂防止性能が優れた半導体装置を提供する。【解決手段】半導体装置は、並列接続された複数の半導体素子モジュールを備える。半導体素子モジュールSM1a、SM1bは、板状の半導体素子40を少なくとも1つ備える。半導体素子40の一面と接する金属部材20と半導体素子40の他面と接する第2金属部材30と半導体素子40とを積層する。金属強化部材50は、積層される金属部材20、半導体素子40及び金属部材30の積層方向の上下を囲むように設けられる。金属部材30と金属強化部材50とは、接続導体90を介して接続される。接続導体90は、第2金属部材30ないし金属強化部材50より電気抵抗率の大きい。金属強化部材50に接続される第2接続導体95は、金属部材20ないし第2金属部材30よりも電気抵抗率が大きい。【選択図】図9 |
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Bibliography: | Application Number: JP20180164944 |