MEMS MICROPHONE

• Main Author: OGATA YUKI
• Format: Patent
• Language: English; Japanese
• Published: 05.03.2020
• Subjects: DEAF-AID SETS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS; PUBLIC ADDRESS SYSTEMS

To inexpensively achieve highly accurate control of frequency characteristics and also prevention of invasion of dust and a foreign matter from an outer side concerning an MEMS microphone.SOLUTION: A MEMS microphone 20 includes: a MEMS acoustic chip 2 for converting a sound signal into an electric signal; a signal processing chip 4 for amplifying an electric signal transmitted from the MEMS acoustic chip 2; and a circuit board 1 that has an upper surface 1a on which the MEMS acoustic chip 2 and the signal processing chip 4 are mounted, and where a copper foil pattern 1c to be partially exposed to the upper surface 1a and a photosensitive film 1e for covering the copper foil pattern 1c are arranged. The circuit board 1 includes: a first hole 1g opened in the upper surface 1a; a second hole 1h opened in a lower surface 1b; and an acoustic flow channel 1i that communicates with the first hole 1g and the second hole 1h and is formed along the upper surface 1a. A height of the acoustic flow channel 1i is equal to a thickness of the copper foil pattern 1c.SELECTED DRAWING: Figure 1 【課題】ＭＥＭＳマイクロホンにおいて周波数特性を高精度に制御することや外部からのダストや異物の浸入を防ぐことを低コストで実現する。【解決手段】ＭＥＭＳマイクロホン２０は、音の信号を電気信号に変換するＭＥＭＳ音響チップ２と、ＭＥＭＳ音響チップ２から送信された電気信号を増幅する信号処理チップ４と、ＭＥＭＳ音響チップ２および信号処理チップ４が搭載される上面１ａを備え、一部が上面１ａに露出する銅箔パターン１ｃと銅箔パターン１ｃを覆う感光性フィルム１ｅとが設けられた回路基板１と、を有する。回路基板１は、上面１ａで開口する第１穴部１ｇと、下面１ｂで開口する第２穴部１ｈと、第１穴部１ｇと第２穴部１ｈとを連通し、かつ上面１ａに沿って形成された音響流路１ｉと、を備え、音響流路１ｉの高さは、銅箔パターン１ｃの厚さと等しい。【選択図】図１