WORKPIECE CLEANING METHOD AND CLEANING DEVICE

• Main Authors: SUZUKI EISUKE, SUZUKI TATSUTOSHI, SUZUKI DAISUKE
• Format: Patent
• Language: English; Japanese
• Published: 05.03.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a workpiece cleaning method and a cleaning device capable of easily removing a harmful component attached to a workpiece.SOLUTION: A workpiece cleaning method includes a removal step of removing all or a part of harmful components attached to the surface of a workpiece together with the surface of the workpiece by a catalytic reaction with the cleaning substance by bringing the workpiece to which the harmful component that impairs the quality adheres into contact with or in the proximity of a cleaning substance that causes a catalytic reaction in relation to the harmful component and the workpiece, and after the removal step, it preferably includes a cleaning step of removing all or a part of the components of the cleaning substance from the workpiece to which the components of the cleaning substance are attached by at least one of wet cleaning, dry cleaning, and scrub cleaning.SELECTED DRAWING: Figure 1 【課題】被加工物に付着した有害成分を容易に除去できる被加工物のクリーニング方法及びクリーニング装置を提供すること。【解決手段】品質を損なう有害成分が付着した被加工物を、有害成分及び被加工物との関係で触媒反応を生じさせる洗浄用物質に当接または近接させることで、洗浄用物質による触媒反応によって、被加工物の表面に付着した有害成分の全部又は一部を、被加工物の表面とともに除去する除去工程を含む。また、除去工程の後に、洗浄用物質の成分が付着した被加工物から、洗浄用物質の成分の全部又は一部を、ウェット洗浄、ドライ洗浄またはスクラブ洗浄の少なくともいずれかの手段により除去する洗浄工程を含むことが好ましい。【選択図】図１