SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

• Main Authors: YAHIRO SHUNICHI, KAJIWARA HIRONOBU, SAKAI MITSUHIRO
• Format: Patent
• Language: English; Japanese
• Published: 05.03.2020
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

To provide a technique for shortening an overall length of a substrate processing apparatus.SOLUTION: The substrate processing apparatus includes: a coating line 4; a first transfer unit 8; a heat treatment line 5; and a second transfer unit 9. The coating line applies a processing liquid to a substrate. The first transport unit transports the substrate to the coating line. The heat treatment line is arranged in parallel with the coating line and performs heat treatment on the substrate on which the processing liquid is coated. The second transport unit transports the substrate on which the processing liquid is coated from the coating line to the heat treatment line. Further, the first transfer unit unloads the substrate on which the heat treatment is performed from the heat treatment line.SELECTED DRAWING: Figure 1 【課題】基板処理装置の全長を短くする技術を提供する。【解決手段】実施形態に係る基板処理装置は、塗布ライン４と、第１搬送部８と、熱処理ライン５と、第２搬送部９とを備える。塗布ラインは、基板に処理液を塗布する。第１搬送部は、塗布ラインに基板を搬送する。熱処理ラインは、塗布ラインに対して並列に配置され、処理液が塗布された基板に熱処理を行う。第２搬送部は、塗布ラインから熱処理ラインに処理液が塗布された基板を搬送する。また、第１搬送部は、熱処理が行われた基板を熱処理ラインから搬出する。【選択図】図１