SUBSTRATE PROCESSING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

• Main Authors: KITAGAWA HAKUBA, YOSHIMIZU YASUTO, ITO FUYUMA, TANIZAKI HIROYUKI
• Format: Patent
• Language: English; Japanese
• Published: 05.03.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a substrate processing apparatus and a manufacturing method of a semiconductor device capable of accurately detecting a change in a processing solution.SOLUTION: A substrate processing apparatus according to an embodiment includes a support portion that supports and rotates a substrate, and a liquid supply portion that supplies a processing liquid to the substrate. The apparatus further includes a side wall that is provided at a distance from the support portion, and surrounds at least partially around the support portion, and a detector that is provided between the support portion and the side wall, and detects a change in the processing liquid after the processing of the substrate is performed.SELECTED DRAWING: Figure 1 【課題】処理液の変化を精度よく検知することが可能な基板処理装置および半導体装置の製造方法を提供する。【解決手段】一の実施形態によれば、基板処理装置は、基板を支持し回転させる支持部と、前記基板に処理液を供給する液供給部とを備える。前記装置はさらに、前記支持部と離間して設けられ、前記支持部を少なくとも部分的に囲む側壁部と、前記支持部と前記側壁部との間に設けられ、前記基板の処理後の前記処理液の変化を検出する検出器とを備える。【選択図】図１