MAGNETRON SPUTTERING APPARATUS AND METHOD OF MANUFACTURING METAL OXIDE FILM

• Main Author: HORIUCHI TATSURO
• Format: Patent
• Language: English; Japanese
• Published: 05.03.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; CONDUCTORS; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; INSULATORS; METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

To provide a magnetron sputtering apparatus capable of reducing impingement of oxygen negative ions on a metal oxide film to be deposited, and a method of manufacturing a metal oxide film using the same.SOLUTION: An apparatus 1 has: a target holder 2 for holding a target 4 made of metal oxide; and a stage 3 having a stage face 30 which faces a top surface 40 of the target 4 held by the target holder 2 and is substantially in parallel. Here, a region obtained by vertically projecting on the stage face 30 an erosion formation estimated region 41 in which it is estimated that erosion is formed on the top surface 40 of the target 4 is an erosion projection region 31, and the distance between the top surface 40 of the target 4 and the stage face 30 is X mm. The apparatus 1 is configured to be able to have a processing object S where sputtered particles P are deposited arranged at an off-axis position 7 within a range which is 0.15X to 0.60X mm outward away from an outer edge of the erosion projection region 31 along the stage face 30.SELECTED DRAWING: Figure 2 【課題】成膜される金属酸化物膜への酸素負イオンの入射を低減させることができるマグネトロンスパッタリング装置、これを用いた金属酸化物膜の製造方法を提供する。【解決手段】装置１は、金属酸化物よりなるターゲット４を保持するためのターゲットホルダー２と、ターゲットホルダー２に保持されるターゲット４の表面４０と対向しかつ略平行なステージ面３０を備えるステージ３とを有する。ターゲット４の表面４０にエロージョンが形成されると推定されるエロージョン形成推定領域４１をステージ面３０上に垂直投影した領域をエロージョン投影領域３１とし、ターゲット４の表面４０とステージ面３０との間の距離をＸｍｍとする。装置１は、エロージョン投影領域３１の外縁からステージ面３０に沿って外方に０．１５Ｘ以上０．６０Ｘｍｍ以下の範囲からなる軸外し位置７に、スパッタ粒子Ｐを堆積させる処理対象物Ｓを配置可能に構成してある。【選択図】図２