METHOD FOR MANUFACTURING CONDUCTIVE LAMINATE, CONDUCTIVE LAMINATE, AND TWO-COMPONENT CONDUCTIVE FILM FORMATION AGENT

To provide a conductive laminate having a conductive film having excellent adhesion to a base material, and a method for manufacturing the same.SOLUTION: A method for manufacturing a conductive laminate includes: a step of providing a resin composition layer containing a thermosetting resin on a bas...

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Bibliographic Details
Main Authors URASHIMA KOSUKE, EJIRI YOSHINORI, NODO TAKAAKI, AKEBI RYUJI, YONEKURA GENKI
Format Patent
LanguageEnglish
Japanese
Published 05.03.2020
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Summary:To provide a conductive laminate having a conductive film having excellent adhesion to a base material, and a method for manufacturing the same.SOLUTION: A method for manufacturing a conductive laminate includes: a step of providing a resin composition layer containing a thermosetting resin on a base material; a step of providing a metal particle-containing layer containing copper-containing particles on the resin composition layer; and a step of heating the resin composition layer and the metal particle-containing layer to form a conductive film bonded to the base material by a cured product of the resin composition layer. The conductive laminate includes a base material and a conducive film provided on the base material, the conductive film containing a sintered body of the copper-containing particles, and has a cured product of the thermosetting resin composition for bonding the base material and the conductive film therebetween.SELECTED DRAWING: None 【課題】 基材との接着性に優れる導電膜を有する導電性積層体及びその製造方法を提供すること。【解決手段】 導電性積層体を製造する方法は、基材上に熱硬化性樹脂を含む樹脂組成物層を設ける工程と、樹脂組成物層上に銅含有粒子を含む金属粒子含有層を設ける工程と、樹脂組成物層及び金属粒子含有層を加熱することにより、樹脂組成物層の硬化物によって基材に接着された導電膜を形成する工程とを備える。導電性積層体は、基材と、該基材上に設けられた導電膜とを備え、導電膜が銅含有粒子の焼結体を含み、基材と導電膜との間に、これらを接着する熱硬化性樹脂組成物の硬化物を有する。【選択図】なし
Bibliography:Application Number: JP20180162447