CONDUCTOR FORMATION METHOD

• Main Authors: URASHIMA KOSUKE, EJIRI YOSHINORI, NODO TAKAAKI, AKEBI RYUJI, YONEKURA GENKI
• Format: Patent
• Language: English; Japanese
• Published: 27.02.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASTING; CONDUCTORS; ELECTRICITY; INSULATORS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; PERFORMING OPERATIONS; POWDER METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; TRANSPORTING; WORKING METALLIC POWDER

To provide a conductor formation method which can simply form a conductor which projects from a base material and has a desired shape on a base material in a short time.SOLUTION: A method for forming a conductor having a shape projecting from a base material on the base material includes a step of discharging a droplet-like composition for forming a conductor from a position with a distance of 0.05 mm to 10.0 mm from the base material to stack the composition for forming the conductor onto the base material, in which the composition for forming the conductor contains copper-containing particles containing copper and a dispersion medium for dispersing the copper-containing particles, and has viscosity at 25°C of 1-800 Pa s and a thixotropy index measured according to JIS Z3284 of 0.50-0.90.SELECTED DRAWING: None 【課題】 基材上に基材から突出する所望の形状を有する導体を、簡便且つ短時間で形成することができる導体の形成方法を提供すること。【解決手段】 基材上に該基材から突出する形状を有する導体を形成する方法であって、基材から０．０５ｍｍ〜１０．０ｍｍの距離の位置から液滴状の導体形成用組成物を吐出することにより基材上に導体形成用組成物を積み上げる工程を備え、導体形成用組成物は、銅を含有する銅含有粒子と、銅含有粒子を分散させる分散媒とを含み、２５℃における粘度が１〜８００Ｐａ・ｓであり、ＪＩＳ Ｚ３２８４に従って測定されるチキソトロピーインデックスが０．５０〜０．９０である。【選択図】 なし