METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT

• Main Authors: MINAMI TAKESHI, MURATA MICHIAKI, ONO KENICHI
• Format: Patent
• Language: English; Japanese
• Published: 20.02.2020
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide a method of manufacturing a semiconductor element capable of suppressing cracks of a substrate compared with a case where the substrate is transferred or the like in a non-divided state, and of reducing the number of steps compared with a case where heat treatment or the like is performed for each divided individualized substrate.SOLUTION: A method of manufacturing a semiconductor element includes the following steps of: fixing a wafer (10) to a support member (16) while making a front face on which a plurality of semiconductor elements (12) are formed contacted and dividing the wafer into a plurality of individualized wafers (20) each including some of the plurality of semiconductor elements (12); arranging the plurality of individualized wafers (20) on a transfer member (25) so that a rear face not formed with the plurality of semiconductor elements (12) is at the transfer member (25) side and removing the support member (16) from the plurality of individualized wafers (20); and performing heat treatment to the plurality of individualized wafers (20) from which the support member (16) has been removed in a state where the wafers are arranged on the transfer member (25).SELECTED DRAWING: Figure 1 【課題】未分割の状態で搬送等を行う場合と比較し基板割れが抑制され、かつ分割された個片基板ごとに熱処理等を行う場合と比較し工程数が低減された半導体素子の製造方法を提供すること。【解決手段】複数の半導体素子（１２）が形成されたおもて面を接触させてウェハ（１０）を支持部材（１６）に固定し、複数の半導体素子（１２）の一部が含まれる複数の個片ウェハ（２０）に分割する工程と、複数の半導体素子（１２）が形成されていない裏面が搬送部材（２５）側となるように複数の個片ウェハ（２０）を当該搬送部材（２５）に配置し、複数の個片ウェハ（２０）から支持部材（１６）を除去する工程と、支持部材（１６）が除去された複数の個片ウェハ（２０）を搬送部材（２５）に配置した状態で熱処理する工程と、を含む。【選択図】図１