LED PACKAGE AND LED DISPLAY DEVICE

• Main Authors: KOBUCHI KEIYO, ITAI JUNICHI
• Format: Patent
• Language: English; Japanese
• Published: 13.02.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide an LED package capable of stabilizing the amount of luminous flux emitted for a long period of time while achieving downsizing, and an LED display device including the same.SOLUTION: An LED package includes: a substrate 10 having a main surface 10A and a rear surface 10B facing an opposite side each other in a thickness direction z; first wiring 20 and second wiring 30 arranged on the substrate 10; an LED chip 40 arranged on the main surface 10A and electrically connected to both the first wiring 20 and the second wiring 30; and a sealing resin 70 covering the LED chip 40. The substrate 10 contains a plurality of glass cloths 11 stacked in the thickness direction z, and an impregnated resin 12 impregnated into the plurality of glass cloths 11. The impregnated resin 12 includes an acrylic resin, and the sealing resin 70 contains silicone.SELECTED DRAWING: Figure 7 【課題】 小型化を図りつつ、出射される光束量の長期安定化が可能なＬＥＤパッケージ、およびそれを備えるＬＥＤ表示装置を提供する。【解決手段】 厚さ方向ｚにおいて互いに反対側を向く主面１０Ａおよび裏面１０Ｂを有する基板１０と、基板１０に配置された第１配線２０および第２配線３０と、主面１０Ａの上に配置され、かつ第１配線２０および第２配線３０の双方に導通するＬＥＤチップ４０と、ＬＥＤチップ４０を覆う封止樹脂７０と、を備え、基板１０には、厚さ方向ｚに積層された複数のガラスクロス１１と、複数のガラスクロス１１に含浸された含浸樹脂１２と、が含有され、含浸樹脂１２は、アクリル樹脂を含み、封止樹脂７０には、シリコーンが含有されている。【選択図】 図７