BACK GRINDING TAPE

• Main Author: KAMEI KATSUTOSHI
• Format: Patent
• Language: English; Japanese
• Published: 13.02.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DRESSING OR CONDITIONING OF ABRADING SURFACES; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

To provide a back grinding tape used in a back grinding step performed after dicing, the back grinding tape having excellent follow-up performance to an uneven surface while preventing chip chipping that may occur in back grinding.SOLUTION: A back grinding tape of the present invention includes an adhesive layer, an intermediate layer, and a first base material, in the order. The material constituting the intermediate layer is an acrylic resin that has a carboxyl group and is not cross-linked, the intermediate layer has a storage modulus E'at 23°C of 200 MPa or less, and the initial adhesive strength when the adhesive layer is adhered to an Si mirror wafer is 1-30 N/20 mm.SELECTED DRAWING: Figure 1 【課題】ダイシングの後に行われるバックグラインド工程に用いられるバックグラインドテープであって、バックグラインド時に生じ得るチップ欠けを防止しつつ、凹凸面への追従性に優れるバックグラインドテープを提供すること。【解決手段】本発明のバックグラインドテープは、粘着剤層と、中間層と、第１の基材とをこの順に備え、該中間層を構成する材料が、カルボキシル基を有し、かつ、架橋していないアクリル系樹脂であり、該中間層の２３℃における貯蔵弾性率Ｅ'が、２００ＭＰａ以下であり、該粘着剤層をＳｉミラーウエハに貼着した際の初期粘着力が、１Ｎ／２０ｍｍ〜３０Ｎ／２０ｍｍである。【選択図】図１