ELECTRONIC COMPONENT PACKAGE

• Main Authors: CAI YONGFU, YAMAWAKI KAZUMA, MIYAZAKI SHUHEI
• Format: Patent
• Language: English; Japanese
• Published: 30.01.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide an electronic component package with higher operational reliability.SOLUTION: An electronic component package comprises an electronic component module comprising: a base portion including a first surface and a second surface; a first plating layer covering the first surface; a first electronic component chip provided on the first plating layer via a first insulating layer; a second plating layer covering the second surface; and a second electronic component chip provided on the second plating layer via a second insulating layer. Here, the first plating layer and the second plating layer have a first metal material that is less likely to cause an ion migration phenomenon than Ag (silver).SELECTED DRAWING: Figure 1 【課題】より動作信頼性に優れる電子部品パッケージを提供する。【解決手段】この電子部品パッケージは、第１の面と第２の面とを含むベース部と、第１の面を覆う第１のめっき層と、その第１のめっき層上に第１の絶縁層を介して設けられた第１の電子部品チップと、第２の面を覆う第２のめっき層と、その第２のめっき層上に第２の絶縁層を介して設けられた第２の電子部品チップとを有する電子部品モジュールを備える。ここで、第１のめっき層および第２のめっき層は、Ａｇ（銀）よりもイオンマイグレーション現象を生じにくい第１の金属材料を有する。【選択図】図１