SHEET MATERIAL, CIRCUIT BOARD, PROGRAM FOR CREATING CIRCUIT BOARD, MICROCAPSULE, THERMALLY EXPANDABLE MATERIAL, AND BUTTON STRUCTURE
To easily create an electronic circuit.SOLUTION: A sheet member 40 comprises a base layer 41 and a thermally expandable layer 42 formed on the base layer. The thermally expandable layer includes a microcapsule 51 and a binder 56 having an insulating property. The microcapsule includes a shell 52 inc...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
30.01.2020
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Subjects | |
Online Access | Get full text |
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Summary: | To easily create an electronic circuit.SOLUTION: A sheet member 40 comprises a base layer 41 and a thermally expandable layer 42 formed on the base layer. The thermally expandable layer includes a microcapsule 51 and a binder 56 having an insulating property. The microcapsule includes a shell 52 including a conductive component (metal filler 57), and a thermally expandable component (core 53) that is included in the shell and expands when heated. The shell is deformed in accordance with the expansion of the thermally expandable component, such that the shell comes into contact with another capsule and conducts with the other capsule.SELECTED DRAWING: Figure 1B
【課題】電子回路を容易に作成する。【解決手段】シート材40は、基材層41と、基材層の上に形成された熱膨張性層42と、を備えている。熱膨張性層は、マイクロカプセル51と、絶縁性を有するバインダー56と、を含む。マイクロカプセルは、導電性成分(金属フィラー57)を含有するシェル52と、シェルに内包され、かつ、加熱されることで膨張する熱膨張性成分(コア53)と、を有している。シェルは、熱膨張性成分の膨張に伴って変形することで、他のカプセルと接触して、他のカプセルとの間で導通する。【選択図】図1B |
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Bibliography: | Application Number: JP20180139791 |