RELAY MODULE
To provide a relay module capable of achieving a more reduction in vibration of individual relays.SOLUTION: A relay module includes a plurality of relays 2, a mounting substrate 4 mounting the relays 2 thereon, and a damping member 3. Each of the relays 2 includes an electromagnetic coil 21, a switc...
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Main Authors | , , , , |
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Format | Patent |
Language | English Japanese |
Published |
30.01.2020
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a relay module capable of achieving a more reduction in vibration of individual relays.SOLUTION: A relay module includes a plurality of relays 2, a mounting substrate 4 mounting the relays 2 thereon, and a damping member 3. Each of the relays 2 includes an electromagnetic coil 21, a switch, and a case 23. The switch performs on/off operations depending on the presence/absence of energization to the electromagnetic coil 21. The electromagnetic coil 21 and the switch are received in the case 23. The damping member 3 is made of a material having a smaller Young's modulus than the case 23. The damping member 3 suppresses the vibration of the relays 2. The damping member 3 is held by the two relays 2.SELECTED DRAWING: Figure 1
【課題】個々のリレーの振動をより低減できるリレーモジュールを提供すること。【解決手段】複数のリレー2と、該複数のリレー2を搭載した搭載基板4と、制振部材3とを備える。個々のリレー2は、電磁コイル21と、スイッチと、ケース23とを有する。スイッチは、電磁コイル21への通電の有無によりオンオフ動作する。電磁コイル21とスイッチは、ケース23に収容されている。制振部材3は、ケース23よりもヤング率が小さい材料からなる。制振部材3は、リレー2の振動を抑制する。2個のリレー2によって制振部材3を挟持してある。【選択図】図1 |
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Bibliography: | Application Number: JP20180139232 |