COMPOSITION FOR FORMING CONDUCTOR, AND MANUFACTURING METHOD OF ARTICLE HAVING CONDUCTOR LAYER

• Main Authors: URASHIMA KOSUKE, EJIRI YOSHINORI, NODO TAKAAKI, AKEBI RYUJI, YONEKURA GENKI
• Format: Patent
• Language: English; Japanese
• Published: 30.01.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASTING; CONDUCTORS; ELECTRICITY; INSULATORS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; PERFORMING OPERATIONS; POWDER METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; TRANSPORTING; WORKING METALLIC POWDER

To provide a composition for forming a conductor capable of forming a fine conductor layer at high accuracy even when a drop-shaped composition for forming the conductor is discharged from a position largely separated from a substrate, when a conductor layer is formed by a method including forming a film of the composition for forming the conductor onto the substrate by a printing method for discharging the drop-shaped composition for forming the conductor.SOLUTION: There is disclosed a composition for forming a conductor containing a copper-containing particle and a dispersant in which the copper-containing particle is dispersed. Viscosity of the composition for forming the conductor at 25°C is 0.10 to 300 Pa s, and thixotropic index of the composition for forming the conductor measured according to JIS Z3284 is 0.50 to 0.90.SELECTED DRAWING: None 【課題】液滴状の導体形成用組成物を吐出する印刷法により基材上に導体形成用組成物の膜を形成することを含む方法によって導体層を形成する場合において、基材から大きく離れた位置から液滴状の導体形成用組成物を吐出するときであっても、微細な導体層を高い精度で形成することを可能にする導体形成用組成物を提供すること。【解決手段】銅含有粒子と、銅含有粒子が分散している分散媒と、を含有する、導体形成用組成物が開示される。導体形成用組成物の２５℃における粘度が０．１０〜３００Ｐａ・ｓであり、当該導体形成用組成物のＪＩＳ Ｚ３２８４に従って測定されるチキソトロピーインデックスが０．５０〜０．９０である。【選択図】なし