IMAGING ELEMENT AND ELECTRONIC APPARATUS

• Main Authors: OOKA YUTAKA, YOSHIDA HIROKAZU, MASUDA YOSHIAKI, SAITO SOTETSU, ISHII WATARU, MATSUOKA SHINICHI, KAMEI TAKAHIRO, SATO NAOKI
• Format: Patent
• Language: English; Japanese
• Published: 23.01.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES

To provide an imaging element and an electronic apparatus, capable of improving reliability.SOLUTION: The imaging element includes: a sensor substrate having a light-receiving region in which a plurality of light-receiving elements are arranged, and a peripheral region is provided around the light-receiving region; a sealing member disposed to face one surface of the sensor substrate; a resin layer for bonding the sensor substrate and the sealing member; and a dug portion which is provided in a peripheral region on one surface of the sensor substrate, and in which the resin layer is embedded. The resin layer has one or more voids inside the dug portion in plan view.SELECTED DRAWING: Figure 1 【課題】信頼性を向上させることが可能な撮像素子および電子機器を提供する。【解決手段】本開示の一実施形態の撮像素子は、複数の受光素子が配列された受光領域および受光領域の周囲に設けられた周辺領域を有するセンサ基板と、センサ基板の一の面と対向配置された封止部材と、センサ基板と封止部材とを貼り合わせる樹脂層と、センサ基板の一の面の周辺領域に設けられると共に、樹脂層が埋設された掘り込み部とを備え、樹脂層は、平面視において、掘り込み部の内側に１または複数の空隙を有する。【選択図】図１