COMPOSITION FOR SEMICONDUCTOR CHIP PROTECTION BUFFER COATING MATERIAL, FILM FOR SEMICONDUCTOR CHIP PROTECTION BUFFER COAT ARRANGED BY USE THEREOF, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE
To provide: a composition for a semiconductor chip protection buffer coating material to form a resin layer for protection on an electronic component package outermost layer, and to suppress a flash or break of a semiconductor chip sealing resin under a high-dicing speed condition; a film for semico...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English Japanese |
Published |
16.01.2020
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | To provide: a composition for a semiconductor chip protection buffer coating material to form a resin layer for protection on an electronic component package outermost layer, and to suppress a flash or break of a semiconductor chip sealing resin under a high-dicing speed condition; a film for semiconductor chip protection buffer coat, which is arranged by use of the composition; and a method for manufacturing an electronic component package.SOLUTION: A composition for semiconductor chip protection buffer coating material comprises (A) an epoxy resin, (B) a phenol resin, (C) an inorganic filler and (D) rubber particles. The inorganic filler (C) has a volume-average particle diameter of 0.1-15 μm.SELECTED DRAWING: None
【課題】保護用樹脂層を電子部品パッケージ最外層に形成し、ダイシングスピードの速い条件下で、半導体チップ封止樹脂のバリ、欠けを低減するための、半導体チップ保護バッファーコート材用組成物、それを用いた半導体チップ保護バッファーコート用フィルムと電子部品パッケージの製造方法を提供する。【解決手段】 (A)エポキシ樹脂、(B)フェノール樹脂、(C)無機フィラー及び(D)ゴム粒子を含有し、前記(C)無機フィラーの体積平均粒子径が、0.1〜15μmである半導体チップ保護バッファーコート材用組成物。【選択図】なし |
---|---|
AbstractList | To provide: a composition for a semiconductor chip protection buffer coating material to form a resin layer for protection on an electronic component package outermost layer, and to suppress a flash or break of a semiconductor chip sealing resin under a high-dicing speed condition; a film for semiconductor chip protection buffer coat, which is arranged by use of the composition; and a method for manufacturing an electronic component package.SOLUTION: A composition for semiconductor chip protection buffer coating material comprises (A) an epoxy resin, (B) a phenol resin, (C) an inorganic filler and (D) rubber particles. The inorganic filler (C) has a volume-average particle diameter of 0.1-15 μm.SELECTED DRAWING: None
【課題】保護用樹脂層を電子部品パッケージ最外層に形成し、ダイシングスピードの速い条件下で、半導体チップ封止樹脂のバリ、欠けを低減するための、半導体チップ保護バッファーコート材用組成物、それを用いた半導体チップ保護バッファーコート用フィルムと電子部品パッケージの製造方法を提供する。【解決手段】 (A)エポキシ樹脂、(B)フェノール樹脂、(C)無機フィラー及び(D)ゴム粒子を含有し、前記(C)無機フィラーの体積平均粒子径が、0.1〜15μmである半導体チップ保護バッファーコート材用組成物。【選択図】なし |
Author | WATASE YUSUKE NOMURA YUTAKA HAMA MASAYUKI |
Author_xml | – fullname: HAMA MASAYUKI – fullname: NOMURA YUTAKA – fullname: WATASE YUSUKE |
BookMark | eNqVTrtOw0AQdAFFgPzDKnWQrJAm5Wa9Zx_4dk_nvSJVFKGjipxI4TP5KIzFB0A1mtG8Hqq78TKWRfVFGqIO3rwKOE0wcPCk0mSyiVHnI8SkxjQ79tk5nmRF89JCQOPksV-D8334Xx4wJZSWG9gfIA8M1nFidWtAaSCwddrMjQElOyTL6WeS-6kqqXiC-bqwGESkN2z5qbr_OJ1vZfmLj9XKsVH3XK6XY7ldT-9lLJ_H17ipN3Vd73bbLb78yfQNS3lTVQ |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | 半導体チップ保護バッファーコート材用組成物、及びそれを用いた半導体チップ保護バッファーコート用フィルム、電子部品パッケージの製造方法 |
ExternalDocumentID | JP2020009944A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_JP2020009944A3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 15:53:08 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English Japanese |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_JP2020009944A3 |
Notes | Application Number: JP20180130706 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200116&DB=EPODOC&CC=JP&NR=2020009944A |
ParticipantIDs | epo_espacenet_JP2020009944A |
PublicationCentury | 2000 |
PublicationDate | 20200116 |
PublicationDateYYYYMMDD | 2020-01-16 |
PublicationDate_xml | – month: 01 year: 2020 text: 20200116 day: 16 |
PublicationDecade | 2020 |
PublicationYear | 2020 |
RelatedCompanies | HITACHI CHEMICAL CO LTD |
RelatedCompanies_xml | – name: HITACHI CHEMICAL CO LTD |
Score | 3.3728547 |
Snippet | To provide: a composition for a semiconductor chip protection buffer coating material to form a resin layer for protection on an electronic component package... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
Title | COMPOSITION FOR SEMICONDUCTOR CHIP PROTECTION BUFFER COATING MATERIAL, FILM FOR SEMICONDUCTOR CHIP PROTECTION BUFFER COAT ARRANGED BY USE THEREOF, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200116&DB=EPODOC&locale=&CC=JP&NR=2020009944A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV3dT8IwEG8QjfqmqFFR0xjDE0TB8bEHYkrXsSFrl9EZfCLb2BI1ASIY_0n_KK8VlCcS3_qRXpprrve7j14Rusli0HqRym6oV8cVI6u2KlESg81TTxpmsxo10kT5OzzecEKjN6wPc-ht9RZG1wn91MURQaISkPeFvq9nf04sS-dWzm_jFxiaPtiybZWW1nFNxxVKVqfNfGEJWqK03fNLPPiZAzRkGGQLbSscrQrts6eOepYyW9cp9gHa8YHcZHGIcq9RAe3R1ddrBbTrLSPe0FwK3_wIfVHh-WLgKqcSBuMNDxQPBbdCKqFHHdfHfiAk03khuBPaNoNhQaTLu9gjAFxd0i9j2-17_1uPSRAQ3mUW7jzjcMCwdFjAhF3GhFvYY9IRlqboER7ahMpQ5Vhg1gdSgeAuxXrrnHGJfUIfSZcdo2ubSepUgC2j30MY9fw1Ft6foPxkOklPEW4BgItAC2aROTaaaWSmRjPL6rX4LonNlmGeoeIGQucbZ4toX_WUx6PauED5xftHegkYYBFf6bP7Bo_npsE |
link.rule.ids | 230,309,786,891,25594,76904 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlR1dS8MwMPiF-uYn6vwIInty6LRr14chWZqunW1SulTm02i7FlTYhk78k_4oL3FTnwa-JXfkCHdc7iOXC0IXZQZWL1XVDY36sGaU9WYtzTOIeRq5aVv11Cxyle8IueklRrff6C-hl_lbGN0n9EM3RwSNykHfp_q8nvwmsRxdW_l2lT0BaHznypZTnUXHN_peoeq0WywSjqBVSlvdqMrjbxx4Q4ZBltGqBTGharTPHtrqWcrkr01xt9BaBORG02209JzuoA06_3ptB62HsxtvGM6U720XfVIRRqLnq6QShuAN9xQPBXcSKmFGPT_CUSwk03UhuJ24LgOwINLnHRwScFx9Elxi1w_C_63HJI4J7zAHtx9x0mNYeixmwr3EhDs4ZNITjqYYEp64hMpE1VhgFgCpWHCfYr11zrjEEaH3pMP20LnLJPVqwJbBjxAG3egPC2_30cpoPCoOEG6CA5eCFSxTe2hYRWoXhlWWjZvsOs_spmEfosoCQkcLsWdow5NhMAh8fl9Bmwqjsh918xitTF_fixPwB6bZqZbjF4RGqaw |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=COMPOSITION+FOR+SEMICONDUCTOR+CHIP+PROTECTION+BUFFER+COATING+MATERIAL%2C+FILM+FOR+SEMICONDUCTOR+CHIP+PROTECTION+BUFFER+COAT+ARRANGED+BY+USE+THEREOF%2C+AND+METHOD+FOR+MANUFACTURING+ELECTRONIC+COMPONENT+PACKAGE&rft.inventor=HAMA+MASAYUKI&rft.inventor=NOMURA+YUTAKA&rft.inventor=WATASE+YUSUKE&rft.date=2020-01-16&rft.externalDBID=A&rft.externalDocID=JP2020009944A |